Boardroom Consulting (PG0179265-U)

A Professional Talent Search Company

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Job ID:                 3040

Position:             Die Prep / Die Attach Engineers (3 positions)

Location:            Bayan Lepas FTZ, Penang.




- Die prep/Die attach CIP & sustaining engineer
- Responsible for the Backgrind/wafer saw/Die-Attach process as demonstrated by the yield and quality/reliability performance of all customer products.
- Knowlegable in handling backgrind/ wafer saw/ Die attach equipment and ovens
- Understand basic semicon process flow
- Perform defect and failure analysis of all anomalies and excursions related to Die Prep/Die Attach
- Drive, initiate and implement continuous improvement projects on yield, quality/reliability, cost and productivity.
- Perform DOEs and evaluations to improve process capability and robustness.
- New or expired Leadframe/Substrate FAI buy-off
- Disposition of excursionary and low-yield material including the use of MRB system for discrepant material traceability together with 8D documentation as required by customers.
- Familiar with APQP, WI, FMEA, DOE, SPC, JMP



Bsc in Engineering (Electronics/Mechanical/Mechatronics) or Applied science with at least 3 years experience in assembly FOL processes.


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