BOARDROOM
CONSULTING

Boardroom Consulting (PG0179265-U)

A Professional Talent Search Company

www.boardroom-consulting.com

Any question about this position, please refer to your recruitment consultant. Email: jobs@boardroom-consulting.com

 

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Job ID:                1041

Position:             FOL Manager

Location:            Dongguan, China.

 

ROLE PURPOSE:
To lead a team of engineers to improve yield, quality and reduce cost. To guide engineers & provide solutions on process problems using analytical and engineering approach.

 JOB REQUIREMENTS:

  1. PhD/Master Degree/Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.
  2. Fresh PhD/Master Degree with over 5years or Bachelor Degree with over 10years working experience in related process in high volume electronics manufacturing environment preferably semiconductor.

 KEY TASKS & RESPONSIBILITIES:

  1. Leading a team of engineers to meet departmental goals (Yield Improvement, Cost Reduction Projects)
  2. Assembly Yield and Process Improvement Projects.
  3. New Package and Process Buy off acceptance from NPI to Production for readiness.
  4. Mold Process Parameters Review
  5. Review and approve buildsheet and new design packages
  6. Lead customer CARS.
  7. New Capacity Equipment signoff for productions.
  8. Lead process issues and hold lots (8D,PDA,MRB)
  9. CPK Improvement Actions
  10. Lead process CFT for improvement
  11. Provide teamwork support to Qual and engineering lots
  12. Enhancement on line audit for compliance
  13. New material sourcing & qualification
  14. Process Specification review and sign off.
  15. Lead Customer issues and technical discussions

JOB REQUIREMENTS:

  1. Bachelor of science in any engineering discipline.
  2. Minimum 10 years in FOL process (Die Attach & Wire Bond) process and 5 years in supervisory level.
  3. Good knowledge in epoxy, gold wire & Cu wire.
  4. Experience with ASM diebonding machine.
  5. Experience with K&S, ASM, ESEC, Shinkawa wirebonding machine.
  6. Candidate with only knowledge in wire bonding will also be considered but must familiar with Cu wirebonding.
  7. Good written and communication in English & Chinese.
  8. Candidates with good verbal communication in Chinese will also be considered.
  9. Good knowledge in 8D, FMEA & Control Plan
  10. 6-Sigma certification or experience will be an added advantage

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